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Displaying 1-8 of 8 results for keywords "American, Packages of 20"
Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.
- Text
- New York, New York : ASME, c1998.
- 1998
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .T44 1998 Off-site Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, ©1998.
- 1998
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .T44 1998 Off-site Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .A664 1997 Off-site Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, [1997], ©1997.
- 1997-1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .A67 1997g Off-site Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.
- Text
- New York, N.Y. : American Society of Mechanical Engineers, c1997.
- 1997
- 1 Item
Item details Format Call Number Item Location Text TK7870.15 .A664 1997 Off-site 2003 International Symposium on Microelectronics : IMAPS : proceedings : November 18-20, 2003, Hynes Convention Center, Boston, MA / sponsored by IMAPS, International Microelectronics and Packaging Society ; [endorsed by ACerS--the American Ceramic Society ; published in cooperation with SPIE--the International Society for Optical Engineering ; Ken Gilleo, IMAPS 2003 symposium technical program chair].
- Text
- 2003
- 1 Item
Item details Format Call Number Item Location Text TK7874 .I59242 2003g Off-site Report of the Committee of Merchants for the Relief of Colored People, Suffering from the Late Riots in the City of New York [electronic resource].
- Text
- New York : G.A. Whitehorne, Steam Printer, 1863.
- 1863
- 1 Resource
Available Online
http://galenet.galegroup.com/servlet/Sabin?af=RN&ae=CY104934273&srchtp=a&ste=14&q=nyplNew Deal art in the Northwest : the WPA and beyond / Margaret E. Bullock.
- Text
- Tacoma, Washington : Tacoma Art Museum, [2020]
- 2020-2020
- 1 Item
Item details Format Call Number Item Location Text JQG 22-98 Schwarzman Building M2 - Art and Architecture Room 300 Available - Can be used on site. Please visit New York Public Library - Schwarzman Building M2 to submit a request in person.
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