Research Catalog

  • Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.

    • Text
    • New York, New York : ASME, c1998.
    • 1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .T44 1998Off-site
    How do I pick up this item and when will it be ready?
  • Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, ©1998.
    • 1998
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .T44 1998Off-site
    How do I pick up this item and when will it be ready?
  • Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1997.
    • 1997
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .A664 1997Off-site
    How do I pick up this item and when will it be ready?
  • Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, [1997], ©1997.
    • 1997-1997
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .A67 1997gOff-site
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  • Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

    • Text
    • New York, N.Y. : American Society of Mechanical Engineers, c1997.
    • 1997
    • 1 Item
    FormatCall NumberItem Location
    Text TK7870.15 .A664 1997Off-site
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  • 2003 International Symposium on Microelectronics : IMAPS : proceedings : November 18-20, 2003, Hynes Convention Center, Boston, MA / sponsored by IMAPS, International Microelectronics and Packaging Society ; [endorsed by ACerS--the American Ceramic Society ; published in cooperation with SPIE--the International Society for Optical Engineering ; Ken Gilleo, IMAPS 2003 symposium technical program chair].

    • Text
    • 2003
    • 1 Item
    FormatCall NumberItem Location
    Text TK7874 .I59242 2003gOff-site
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  • Report of the Committee of Merchants for the Relief of Colored People, Suffering from the Late Riots in the City of New York [electronic resource].

    • Text
    • New York : G.A. Whitehorne, Steam Printer, 1863.
    • 1863
    • 1 Resource

    Available Online

    http://galenet.galegroup.com/servlet/Sabin?af=RN&ae=CY104934273&srchtp=a&ste=14&q=nypl
  • New Deal art in the Northwest : the WPA and beyond / Margaret E. Bullock.

    • Text
    • Tacoma, Washington : Tacoma Art Museum, [2020]
    • 2020-2020
    • 1 Item
    FormatCall NumberItem Location
    Text JQG 22-98Schwarzman Building M2 - Art and Architecture Room 300

    Available - Can be used on site. Please visit New York Public Library - Schwarzman Building M2 to submit a request in person.

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